High-speed Testing at Up to 100 Points/sec. with Half the Impact Mark Depth
FLYING PROBE TESTER FA1116
The Flying Probe Tester FA1116-03 is a high-speed automatic board tester that uses newly developed low-impact probes and precision soft-landing control to achieve 30% faster cycle times for gold plating and fine pattern testing than legacy products.
HIOKI ATE LINEUP [ The Power to Connect ]
The power to connect that Hioki's printed circuit board testing systems deliver is the power to connect to the future. The ability to continue to support this rich and satisfying lifestyle together with customers is a small part of what testing systems can do.
At Hioki, we strive on a daily basis to improve the contact performance--the power to connect with circuit boards--that is the lifeblood of electrical testing and to seek out the true potential of that capability. This is the path that we follow.
Infomation movie FA1116
Advantages of capacitance testing
Capacitance testing is an essential test technique for reducing flying probe test times.
The greatest advantage of the vacuum-clamp method is that testing can be carried out without regard to the board shape or the number of layers.Products cannot be shipped unless they can be verified to be non-defective through testing.
The ability to test various boards is the top priority for a tester.
Test times are determined by the number of test points and the speed setting, which reflects the extent of impact marks.
Testing can be started without the need to concern yourself with factors such as the board's shape and thickness (single-sided, flexible, package, or CSP).
Advantages of single-sided vacuum-clamp capacitance testing (discontinuity testing)
Single-sided testing is characterized by the ability to conduct continuity testing with other nets.
When using a double-sided contact flying probe tester, it may not be possible to test some points by means of capacitance measurement alone, depending on the ground plane that is set as the reference. For example, shorts between boards can be reliably detected as long as the same reference electrode is clamped.
Stable impact marks and high-speed testing
To the extent that electrical testing is performed, probe impact marks on the circuit board are inevitable.It goes without saying that a fixed set of conditions can be easily identified for the tester if the measurement target conforms to certain fixed conditions itself.
In double-sided contact testing, when it is difficult to ascertain the state of the contact surface, probe contact mechanisms become complex.In short, various conditions conceived to minimize test times (for example, speed and the amount of downward probe force) can be specified quickly since the circuit board has a uniform test surface. The design eliminates the need to use a contact check function or test surface height correction, simplifying testing and shortening the ultimate test time.
Edit Gerber data with the FEB-LINE UA1781.
In the UA1781 data creation system, Hioki developed its own software for editing Gerber data.
This software, the successor to Fly-Line, incorporates the testing expertise necessary to create flying-probe data with proprietary functionality that facilitates tasks that would be troublesome with conventional editing software, for example cavity data and processing of net connections for paint data.
• Super-high-speed testing at up to 100 points/sec
• 30% faster cycle times for gold plating and fine pattern testing
• By combining newly designed probes CP1072-01 and new soft-landing control, the FA1116-03 makes it possible to approach the maximum speed setting during fine pattern testing.
• High resolution of 5 aF to ensure reliable detection of minute changes in capacitance caused by defects (1 aF = 10^-6 pF)
• Support for boards ranging from standard bare boards to flexible boards, BGAs, CSPs, MCMs, and other high-density boards
• Reliable probing of fine-pitch minute pads thanks to a minimum pad diameter of 15 μm
• Support for resistance, inductance, diode, and voltage measurement in addition to capacitance measurement. MLCC(Multi-Layer Ceramic Capacitor) Measurement mode allows JIS-compliant measured value acquisition.
• Extensive measurement functions and optional units reduce backlogs of untested boards.
|Number of arms||2|
|Number of test steps||Max. 40,000 steps/piece
|DC Measurement ranges||Resistance : 400 μΩ to 40 MΩ
Capacitance : 4 μF to 40 mF
Diode, transistor (VF) : 0 to 25 V
Zener diode (VZ) : 0 to 25 V
Short :400 mΩ to 40 kΩ
Open :4 Ω to 4 MΩ
Voltage :0 to 25 V
|AC Measurement ranges||Resistance : 100 Ω to 100 MΩ
Capacitance : 10 fF to 10 μF
Inductance : 10 μH to 100 mH
|Measurement time||Max. 100 points/s (X-Y movements of 0.1 mm, 2 arm simultaneous probing, capacitance measurement)|
|Probe working area||610 mm (24.02 in) W × 510 mm (20.08 in) D|
|Fixed board dimensions||Thickness : 0.1 mm to 3.2 mm (0.13 in)
Outer dimensions : 50 mm (1.97 in) W × 50 mm (1.97 in) D to 610 mm (24.02 in) W × 510 mm (20.08 in) D
Upper surface - 10 mm (0.39 in) (including board thickness)
Lower surface - 0.1 mm (0.00 in)
|Power supply||200 V AC ±10% (single-phase), 50/60 Hz, 3 kVA|
|Dimensions and mass||1,443 mm (56.81 in) W × 1,656 mm (65.20 in) H × 1,185 mm (46.65 in) D, 1,000 kg (35,273.4 oz)|
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There are no drivers, firmware or software available for this product.