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A T E Concept The Power to Connect

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A T E Concept The Power to Connect

Continuing to create new solutions together

SKU: The Power to Connect Category:

Model No. (Order Code)

 

Description

Products concept

[With customers]

The power to connect that Hioki's printed circuit board testing systems deliver is the power to connect to the future.
The ability to continue to support this rich and satisfying lifestyle together with customers is a small part of what testing systems can do.

 

 

Development concept

[Striving to further enhance contact performance]

At Hioki, we strive on a daily basis to improve the contact performance--the power to connect with circuit boards--that is the lifeblood of electrical testing and to seek out the true potential of that capability.
This is the path that we follow.

 

 

HIOKI ATE LINEUP [ The Power to Connect ]

The power to connect that Hioki's printed circuit board testing systems deliver is the power to connect to the future. The ability to continue to support this rich and satisfying lifestyle together with customers is a small part of what testing systems can do.
At Hioki, we strive on a daily basis to improve the contact performance--the power to connect with circuit boards--that is the lifeblood of electrical testing and to seek out the true potential of that capability. This is the path that we follow.

 

 

Specifications overview

  1240-01, 1240-02 1240-03
Number of arms 4 (L, R, ML, MR)
Number of test steps 40,000 (max.)
300,000 (optional feature)
Measurement ranges Resistance: 400 μΩ to 40 MΩ
Capacitance: 1 pF to 400 mF
Inductance: 1 μH to 100 H
Diode VZ measurement: 0 to 25 V
Zener diode VZ measurement: 0 to 25 V, 25 to 80 V (optional feature)
Digital transistors: 0 to 25 V
Photo couplers: 0 to 25 V
Short: 0.4 Ω to 400 kΩ
Open: 4 Ω to 40 MΩ
DC voltage measurement: 0 to 25 V
Measurement time Max. 0.025 sec./step
(X-Y 2.5 mm movements, Z height of 5 mm, simultaneous probing of 3 steps, S/O measurement)
Probing precision Within ±100 μm for each arm (X and Y directions)
Positioning repeatability Within ±50 μm (probing positions)
Inter-probe pitch Min. 0.2 mm (when using needle probes)
Min. 0.5 mm (when using 4-terminal probes)
Probe working area 510 mm (20.08 in) W × 460 mm (18.11 in) D
Testable board dimensions Thickness: 0.6 mm (0.02 in) to 3.2 mm (0.13 in)
Outer dimensions: Min. 50 mm (1.97 in) × 50 mm (1.97 in), max. 510 mm (20.08 in) × 460 mm (18.11 in)
Power supply 200 V AC ±10% (single-phase), 50/60 Hz, 3 kVA
Dimensions and mass 1410 mm (55.51 in) H × 1340 mm (52.76 in) H × 1270 mm (50.00 in) D, 1300 kg (45,855.4 oz) 1260 mm (49.61 in) H × 1300 mm (51.18 in) H × 1200 mm (47.24 in) D, 1050 kg (37,037.0 oz)

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